Exploring the Feasibility of Novel 3D Polyhedrally-Tiled Computing Arrays

Crispin-Bailey, Christopher orcid.org/0000-0003-0613-9698, Thuphairo, Pakon, Austin, Jim orcid.org/0000-0001-5762-8614 et al. (2 more authors) (2025) Exploring the Feasibility of Novel 3D Polyhedrally-Tiled Computing Arrays. IEEE Access. 11146660. pp. 159685-159713. ISSN: 2169-3536

Abstract

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Item Type: Article
Authors/Creators:
Copyright, Publisher and Additional Information:

© 2025 The Authors

Keywords: 3D mesh arrays,future computing,HPC,interconnection network,network topology,polyhedra,power density,system cooling,three-dimensional interconnect
Dates:
  • Accepted: 2 September 2025
  • Published: 17 September 2025
Institution: The University of York
Academic Units: The University of York > Faculty of Sciences (York) > Computer Science (York)
Date Deposited: 01 Oct 2025 16:00
Last Modified: 01 Oct 2025 16:00
Published Version: https://doi.org/10.1109/ACCESS.2025.3605303
Status: Published
Refereed: Yes
Identification Number: 10.1109/ACCESS.2025.3605303
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Open Archives Initiative ID (OAI ID):

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