Case study of a data centre using enclosed, immersed, direct liquid-cooled servers

Chi, YQ, Summers, J, Hopton, P et al. (4 more authors) (2014) Case study of a data centre using enclosed, immersed, direct liquid-cooled servers. In: Proceedings of the 30th Annual Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM 2014, 09-13 Mar 2014, San Jose, CA. Institute of Electrical and Electronics Engineers (IEEE) , pp. 164-173. ISBN 978-1-4799-4374-6

Abstract

Metadata

Item Type: Proceedings Paper
Authors/Creators:
  • Chi, YQ
  • Summers, J
  • Hopton, P
  • Deakin, K
  • Real, A
  • Kapur, N
  • Thompson, H
Copyright, Publisher and Additional Information:

© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Uploaded in accordance with the publisher's self-archiving policy.

Keywords: Direct dielectric liquid cooling; immersed microelectronics; data centre cooling
Dates:
  • Published: 2014
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Engineering Thermofluids, Surfaces & Interfaces (iETSI) (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 10 May 2016 15:21
Last Modified: 17 Jan 2018 09:02
Published Version: http://dx.doi.org/10.1109/SEMI-THERM.2014.6892234
Status: Published
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Identification Number: 10.1109/SEMI-THERM.2014.6892234
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