Wasley, T, Li, J, Kay, R et al. (6 more authors) (2016) Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques. In: Proceedings. 66th Electronic Components and Technology Conference (ECTC 2016), 31 May - 03 Jun 2016, Las Vegas, NV, USA. IEEE , pp. 849-856. ISBN 978-1-5090-1204-6
Abstract
Additive Manufacturing processes can facilitate the rapid iterative product development of electronic devices by optimising their design and functionality. In addition, these methods present a number of potential advantages for improving the production speed and complexity of mass customised and bespoke electronics. In this paper, we present a new digitally driven hybrid fabrication process chain, capable of producing functional, multilayer electronics embedded within geometrically complex 3D printed structures. This has been achieved by interleaving stereolithography, micro-dispensing and surface mount assembly. The resultant combination of different template-less manufacturing techniques enables both the formation of multi-material circuits (conductors and dielectrics) and where the package housing encapsulates the electronics and forms part of the final 3D device. This paper also details the developments around depositing novel freestanding z-Axis interconnects. A 555 timer circuit with flashing LED manufactured within a 3D pyramid was used as a demonstrator. The demonstrator contained circuits with feature sizes down to 170μm, and packaged components of 0603 size, a Small Outline Integrated Circuit (SOIC) and a SMD LED. In addition, flip chip packaging on 3D printed substrates has been demonstrated.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2016 IEEE. This is an author produced version of a paper published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Additive manufacturing; 3D printing; Flip-chip packaging; bespoke electronics; digitally driven fabrication |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds) |
Funding Information: | Funder Grant number Not Assigned EP/L017415/1 |
Depositing User: | Symplectic Publications |
Date Deposited: | 21 Nov 2016 10:17 |
Last Modified: | 01 Dec 2016 23:05 |
Published Version: | https://doi.org/10.1109/ECTC.2016.187 |
Status: | Published |
Publisher: | IEEE |
Identification Number: | 10.1109/ECTC.2016.187 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:107710 |