Partial discharge in silicone gel on power module substrates in high-humidity conditions

Sherriff, M. orcid.org/0000-0003-3212-6233, Griffo, A. orcid.org/0000-0001-5642-2921, Jia, C. et al. (3 more authors) (2025) Partial discharge in silicone gel on power module substrates in high-humidity conditions. IEEE Transactions on Dielectrics and Electrical Insulation, 32 (1). pp. 484-493. ISSN 1070-9878

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Item Type: Article
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© 2024 The Authors. Except as otherwise noted, this author-accepted version of a journal article published in IEEE Transactions on Dielectrics and Electrical Insulation is made available via the University of Sheffield Research Publications and Copyright Policy under the terms of the Creative Commons Attribution 4.0 International License (CC-BY 4.0), which permits unrestricted use, distribution and reproduction in any medium, provided the original work is properly cited. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/

Keywords: Humidity; Testing; Partial discharges; Substrates; Discharges (electric); Copper; Standards
Dates:
  • Published: February 2025
  • Published (online): 22 May 2024
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield)
Depositing User: Symplectic Sheffield
Date Deposited: 11 Jun 2024 14:34
Last Modified: 24 Feb 2025 15:43
Status: Published
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Refereed: Yes
Identification Number: 10.1109/tdei.2024.3404367
Open Archives Initiative ID (OAI ID):

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