Shafique, MF and Robertson, ID (2015) A Two-Stage Process for Laser Prototyping of Microwave Circuits in LTCC Technology. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 5 (6). pp. 723-730. ISSN 2156-3950
Abstract
An improved technique for laser prototyping of microwave circuits in low-temperature cofired ceramic (LTCC) technology is presented. This builds on the method of laser machining of conductor layers in unfired LTCC tapes. The proposed process presents the hybrid approach of circuit fabrication by employing both unfired and post fired laser machining of LTCC substrate, hence giving more flexibility of realizing multilayer components. This allows the low-tolerance microwave structures like couplers and filters to be fabricated on the outer layers because shrinkage uncertainty is no longer a problem. Track widths and gaps of 30 μm are demonstrated with an edge definition of ±2 μm. A stripline coupler and a four-layer spiral inductor is successfully fabricated using this technique to demonstrate the process. The improved process can produce high-precision microwave and millimeter-wave components on the outer layers and provides rapid system-in-package prototyping for research and development.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2015 IEEE. This is an author produced version of a paper published in IEEE Transactions on Components, Packaging, and Manufacturing Technology. Uploaded in accordance with the publisher's self-archiving policy. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Keywords: | Ceramics; laser applications; microwave circuits; multichip modules; thick-film circuits |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Robotics, Autonomous Systems & Sensing (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 20 May 2016 13:36 |
Last Modified: | 15 Feb 2019 09:34 |
Published Version: | https://dx.doi.org/10.1109/TCPMT.2015.2434273 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Identification Number: | 10.1109/TCPMT.2015.2434273 |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:97329 |