Jin, L, Lee, RMA and Robertson, I (2014) Analysis and design of a novel low-loss hollow substrate integrated waveguide. IEEE Transactions on Microwave Theory and Techniques, 62 (8). pp. 1616-1624. ISSN 0018-9480
Abstract
In this paper, a novel hollow substrate integrated waveguide (HSIW) is presented for realizing low-loss millimeter-wave (mm-wave) transmission lines embedded in multi-chip modules. A new analysis method for the HSIW is proposed by treating it as a combination of a two-dielectric loaded rectangular waveguide (RWG) and standard substrate integrated waveguide, where an effective dielectric constant, ∈e, is introduced. An HSIW prototype in the Ka-band is fabricated using a progressive-lamination low-temperature co-fired ceramic technique. The measured results agree well with theoretical calculations and simulations. An average of 0.009-dB/mm loss is achieved in Ka-band, which is comparable to an air-filled RWG. This shows that the technique has great potential for further development to realize highly integrated mm-wave modules.
Metadata
Item Type: | Article |
---|---|
Authors/Creators: |
|
Copyright, Publisher and Additional Information: | © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Keywords: | Millimeter-wave (mm-wave) circuits, multichip modules, transmission lines |
Dates: |
|
Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Robotics, Autonomous Systems & Sensing (Leeds) |
Funding Information: | Funder Grant number EPSRC SP/02/03/10 |
Depositing User: | Symplectic Publications |
Date Deposited: | 20 May 2016 14:35 |
Last Modified: | 14 Feb 2019 05:45 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Identification Number: | 10.1109/TMTT.2014.2328555 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:97275 |