Al-Damook, A, Kapur, N, Summers, JL et al. (1 more author) (2015) An experimental and computational investigation of thermal air flows through perforated pin heat sinks. Applied Thermal Engineering, 89. 365 - 376. ISSN 1359-4311
Abstract
The benefits of using pin fin heat sinks with multiple perforations are investigated using complementary experimental and Computational Fluid Dynamics (CFD) methods. An experimental heat sink with multiple perforations is designed and fabricated and parameter studies of the effect of perforated pin fin design on heat transfer and pressure drops across the heat sinks undertaken. Experimental data is found to agree well with predictions from a CFD model for the conjugate heat transfer into the cooling air stream. The validated CFD model is used to carry out a parametric study of the influence of the number and positioning of circular perforations, which shows that the Nusselt number increases monotonically with the number of pin perforations, while the pressure drop and fan power required to overcome the pressure drop all reduce monotonically. Pins with five perforations are shown to have a 11% larger Nu than for corresponding solid pin cases. These benefits arise due to not only the increased surface area but also heat transfer enhancement near perforations through the formation of localised air jets. In contrast, the locations of the pin perforations are much less influential. When examined in the context of CPU cooling, a conjugate heat transfer analysis shows that improved heat transfer with pin perforations translates into significantly reduced processor case temperatures with the additional benefit of a reduction in the weight of the heat sink’s pins. To achieve these benefits care must be taken to ensure that pin perforations are aligned with the dominant flow direction and manufactured with a good quality surface finish.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2015, Elsevier. This is an author produced version of a paper published in Applied Thermal Engineering. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Heat sinks; conjugate heat transfer; forced convection turbulent airflow; the reliability of electronics cooling applications |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Engineering Thermofluids, Surfaces & Interfaces (iETSI) (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 03 Jul 2015 12:44 |
Last Modified: | 28 Jun 2016 10:36 |
Published Version: | http://dx.doi.org/10.1016/j.applthermaleng.2015.06... |
Status: | Published |
Publisher: | Elsevier |
Identification Number: | 10.1016/j.applthermaleng.2015.06.036 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:87729 |