Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI

Bressloff, N.W. orcid.org/0000-0002-4488-9687 (2022) Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI. Cardiovascular Engineering and Technology, 13 (5). pp. 735-750. ISSN 1869-408X

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Item Type: Article
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© 2022 The Author(s). This is an open access article under the terms of the Creative Commons Attribution License (CC-BY 4.0), which permits unrestricted use, distribution and reproduction in any medium, provided the original work is properly cited.

Keywords: Transcatheter aortic valve implantation (TAVI); TAVI leaflet stress; TAVI leaflet durability; Finite element analysis (FEA); Full valve model crimping simulation
Dates:
  • Published: October 2022
  • Published (online): 1 March 2022
  • Accepted: 2 February 2022
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 11 Sep 2024 09:01
Last Modified: 11 Sep 2024 09:01
Status: Published
Publisher: Springer Nature
Identification Number: 10.1007/s13239-022-00614-6
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