Bournias-Varotsis, A, Han, X, Harris, RA orcid.org/0000-0002-3425-7969 et al. (1 more author) (2019) Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics. Additive Manufacturing, 29. 100799. ISSN 2214-7810
Abstract
Embedded electronics and sensors are becoming increasingly important for the development of Industry 4.0. For small components, space constraints lead to full 3D integration requirements that are only achievable through Additive Manufacturing. Manufacturing metal components usually require high temperatures incompatible with electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with mechanical properties close to bulk, but with the integration of internal embedded electronics, sensors or optics. This paper describes a novel manufacturing route for embedding electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors and insulators were prepared separately from the UAM process thereby separating the electronics preparation from the part consolidation. A dual material polymer layer exhibited the best electrically insulating properties, while providing mechanical protection of printed conductive tracks stable up to 100 °C. General design and UAM process recommendations are given for 3D embedded electronics in a metal matrix.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2019, Elsevier B.V. All rights reserved. This is an author produced version of an article published in Additive Manufacturing. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Ultrasonic additive manufacturing; Ultrasonic consolidation; Embedded electronics; 3D electronics; Sheet lamination; Ultrasonic welding; Metal embedded electronics; UAM |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 09 Jan 2020 11:27 |
Last Modified: | 19 Jul 2020 00:38 |
Status: | Published |
Publisher: | Elsevier |
Identification Number: | 10.1016/j.addma.2019.100799 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:155399 |