Ryspayeva, A, David Arthur Jones, T, Reza Khan, S et al. (6 more authors) (2019) Selective Metallization of 3D Printable Thermoplastic Polyurethanes. IEEE Access, 7. pp. 104947-104955. ISSN 2169-3536
Abstract
This paper presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex (R), SemiFlex (TM), PolyFlex (TM), and NinjaFlex (R). Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex (TM) and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex (TM) material. Electroless copper deposited onto Polyflex (TM) has a sheet resistance of (139.4 ± 7.2) m Ω/ and a copper conductivity of (1.1 ± 0.1) × 10⁷ S/m that is comparable with bulk copper. Copper-plated Polyflex (TM) interconnects were fabricated as a proof of concept demonstrators.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Keywords: | Thermoplastic polyurethane elastomers (TPU); fused filament fabrication (FFF); 3D printing; additive manufacturing (AM); hybrid-AM; silver nanoparticles (Ag NPs); electroless copper plating; FilaFlex (R); SemiFlex (TM); PolyFlex (TM); NinjaFlex (R) |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Funding Information: | Funder Grant number EPSRC EP/N018265/2 |
Depositing User: | Symplectic Publications |
Date Deposited: | 13 Aug 2019 10:30 |
Last Modified: | 13 Aug 2019 10:30 |
Status: | Published |
Publisher: | IEEE |
Identification Number: | 10.1109/ACCESS.2019.2931594 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:149601 |