Vaithilingam, J, Saleh, E orcid.org/0000-0001-9930-5055, Wildman, RD et al. (2 more authors) (2018) Optimisation of Substrate Angles for Multi-material and Multi-functional Inkjet Printing. Scientific Reports, 8. ARTN 9030. ISSN 2045-2322
Abstract
Three dimensional inkjet printing of multiple materials for electronics applications are challenging due to the limited material availability, inconsistencies in layer thickness between dissimilar materials and the need to expose the printed tracks of metal nanoparticles to temperature above 100 °C for sintering. It is envisaged that instead of printing a dielectric and a conductive material on the same plane, by printing conductive tracks on an angled dielectric surface, the required number of silver layers and consequently, the exposure of the polymer to high temperature and the build time of the component can be significantly reduced. Conductive tracks printed with a fixed print height (FH) showed significantly better resolution for all angles than the fixed slope (FS) sample where the print height varied to maintain the slope length. The electrical resistance of the tracks remained under 10Ω up to 60° for FH; whereas for the FS samples, the resistance remained under 10Ω for samples up to 45°. Thus by fixing the print height to 4 mm, precise tracks with low resistance can be printed at substrate angles up to 60°. By adopting this approach, the build height “Z” can be quickly attained with less exposure of the polymer to high temperature.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © The Author(s) 2018. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/. |
Keywords: | Electrical and electronic engineering; Engineering |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 09 Aug 2019 09:11 |
Last Modified: | 09 Aug 2019 09:11 |
Status: | Published |
Publisher: | Nature Research |
Identification Number: | 10.1038/s41598-018-27311-6 |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:149506 |