Zhang, F, Saleh, E, Vaithilingam, J et al. (5 more authors) (2019) Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing, 25. pp. 477-484. ISSN 2214-7810
Abstract
Polyimides are a group of high performance thermal stable dielectric materials used in diverse applications. In this article, we synthesized and developed a high-performance polyimide precursor ink for a Material Jetting (MJ) process. The proposed ink formulation was shown to form a uniform and dense polyimide film through reactive MJ utilising real-time thermo-imidisation process. The printed polyimide film showed a permittivity of 3.41 and degradation temperature around 500 °C, both of which are comparable to commercially available polyimide films. Benefiting from the capability of being able to selectively deposit material through MJ, we propose the use of such a formulation to produce complex circuit board structures by the co-printing of conductive silver tracks and polyimide dielectric layers. By means of selectively depositing 4 μm thick patches at the cross-over points of two circuit patterns, a traditional double-sided printed circuit board (PCB) can be printed on one side, providing the user with higher design freedom to achieve a more compact high performance PCB structure.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2018 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/BY/4.0/) |
Keywords: | 3D print; Additive manufacturing; Printed electronics; Polyimide; Inkjet |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 15 May 2019 10:03 |
Last Modified: | 15 May 2019 10:05 |
Status: | Published |
Publisher: | Elsevier B.V. |
Identification Number: | 10.1016/j.addma.2018.11.017 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:146081 |