Ryspayeva, A, Jones, TDA, Nekouie Esfahani, M et al. (5 more authors) (2019) Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite. IEEE Transactions on Electron Devices, 66 (4). pp. 1843-1848. ISSN 0018-9383
Abstract
This paper presents a novel, direct, selective, vacuum-free, and low-cost method of electroless copper deposition, allowing additive patterning of nonconductive surfaces. Ag nanoparticles (NPs) synthesized inside a photosensitive polymer are acting as seeds for electroless copper deposition. The resulting copper film surface morphology was studied with scanning electron microscopy. Copper films were shown to display a rough grain like structure, covering substrate uniformly with good metal-substrate adhesion. Copper thickness was studied as a function of the plating time, temperature, and Ag NPs seed concentration. A maximal copper thickness of 0.44 ± 0.05 μm was achieved when plated at 30 °C with 0.4 M Ag(I). The minimum feature resolution of copper patterns, grown with 0.025- and 0.1-M silver salt, is attained down to 10 μm. The maximum electrical conductivity of the copper film prepared with 0.025-, 0.1-, and 0.4-M Ag(I) approaches (0.8 ± 0.1) × 10⁷ S/m, (1.1 ± 0.1) ×10⁷ S/m and (1.6 ± 0.4)×10⁷ S/m, respectively. Electroless copper interconnections and LED circuit on glass substrate were fabricated as a proof of concept demonstrators.
Metadata
Item Type: | Article |
---|---|
Authors/Creators: |
|
Copyright, Publisher and Additional Information: | This work is licensed under a Creative Commons Attribution 3.0 License. For more information, see https://creativecommons.org/licenses/by/3.0/ |
Keywords: | Ag nanoparticles (NPs) seeds; electroless copper; metallization of nonconductive surfaces; polymer/Ag nanocomposite |
Dates: |
|
Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 17 Apr 2019 14:18 |
Last Modified: | 17 Apr 2019 14:18 |
Status: | Published |
Publisher: | IEEE |
Identification Number: | 10.1109/TED.2019.2897258 |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:145003 |