Hinton, J, Mirgkizoudi, M, Campos-Zatarain, A et al. (3 more authors) (2018) Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. In: 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. The Electronics System-Integration Technology Conference, 18-21 Sep 2018, Dresden, Germany. ISBN 9781538668139
Abstract
Ceramic substrates are commonly used in the electronics industry across a range of applications such as automotive, aerospace, industrial monitoring, power electronics and electromagnetic devices due to their ability to withstand high temperatures, pressures, radiation and mechanical shock. This paper will present the development of a new digitally-driven hybrid manufacturing process which overcomes many of the current limitations of stand-alone Additive Manufacturing for the production of precision engineered ceramic substrates and packages. This is achieved by interleaving ceramic paste extrusion with sacrificial support printing and micro-machining to produce a three-dimensional ceramic green-state part. A number of substrates were fabricated using a high viscosity, non-Newtonian paste consisting of 96wt% alumina. Thermally processing the substrate at temperatures in excess of 1400 °C yields a monolithic ceramic substrate with resultant shrinkages of ∼18% and part densities of ∼99.8%. The 3D ceramic part is then processed using computer-controlled equipment to selectively dispense a conformal circuit using silver thick film conductor paste, followed by solder dispensing and pick and place surface mount assembly of components. This fully digitally driven approach enables new design freedoms and customization currently not possible with conventional template driven manufacturing methods of ceramic electronic packages.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Keywords: | Ceramics; substrates; three-dimensional displays; manufacturing processes; three-dimensional printing |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 07 Mar 2019 11:12 |
Last Modified: | 09 Mar 2019 00:53 |
Status: | Published |
Identification Number: | 10.1109/ESTC.2018.8546442 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:143358 |