Jones, TDA, Ryspayeva, A, Esfahani, MN et al. (5 more authors) (2019) Direct metallisation of polyetherimide substrates by activation with different metals. Surface and Coatings Technology, 360. pp. 285-296. ISSN 0257-8972
Abstract
This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) × 107 S/m and (3.6 ± 0.2) × 107 S/m, respectively) compared with bulk copper (5.96 × 107 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2019 Elsevier B.V. All rights reserved. This is an author produced version of a paper published in Surface and Coatings Technology. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Direct metallisation; Photoreduction; Polyetherimide; Electroless copper; Metal catalyst; Electrical interconnect |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds) |
Funding Information: | Funder Grant number EPSRC EP/N018265/2 |
Depositing User: | Symplectic Publications |
Date Deposited: | 08 Mar 2019 12:49 |
Last Modified: | 09 Jan 2020 01:39 |
Status: | Published |
Publisher: | Elsevier |
Identification Number: | 10.1016/j.surfcoat.2019.01.023 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:143354 |