Kamel, T., Griffo, A. orcid.org/0000-0001-5642-2921 and Wang, J. (2019) Modelling framework for parallel SiC power MOSFETs chips in modules developed by planar technology. In: 2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC). 2018 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC), 07-09 Nov 2018, Nottingham, United Kingdom. IEEE ISBN 978-1-5386-4192-7
Abstract
This paper presents a modelling framework to simulate transients and steady state performance for SiC power MOSFETs modules. The electro-thermal modelling is implemented using Simscape/MATLAB program based on the single chip characteristics provided in the datasheet. The method can easily incorporate multiple chips and module parasitic components providing a tool for module characterization and to support module design optimization. The simulated model is then experimentally validated at different voltage buses and junction temperatures for a novel SiC MOSFET Module design consists of two parallel chips per switch developed using wire-bond free planar technology.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. Reproduced in accordance with the publisher's self-archiving policy. |
Keywords: | SiC Power MOSFET; Modelling; Parallel Chips per Switch; Planar Technology |
Dates: |
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Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield) |
Funding Information: | Funder Grant number EUROPEAN COMMISSION - HORIZON 2020 I2MPECT - 636170 |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 19 Dec 2018 13:24 |
Last Modified: | 14 Jan 2020 01:38 |
Status: | Published |
Publisher: | IEEE |
Refereed: | Yes |
Identification Number: | 10.1109/ESARS-ITEC.2018.8607625 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:140191 |