Li, J, Wasley, T, Ta, D et al. (7 more authors) (2018) Micro electronic systems via multifunctional additive manufacturing. Rapid Prototyping Journal, 24 (4). pp. 752-763. ISSN 1355-2546
Abstract
Purpose: This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics.
Design/methodology/approach: This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials.
Findings: The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die.
Originality/value: This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2018, Emerald Publishing Limited . This is an author produced version of a paper published in Rapid Prototyping Journal. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Additive manufacturing; DLP stereolithography; Flip chip packaging; Material dispensing; Multilayer embedded electronics; Process integration |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) |
Funding Information: | Funder Grant number EPSRC EP/L017415/1 |
Depositing User: | Symplectic Publications |
Date Deposited: | 03 Nov 2017 16:33 |
Last Modified: | 24 Jul 2018 14:05 |
Status: | Published |
Publisher: | Emerald |
Identification Number: | 10.1108/RPJ-02-2017-0033 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:123194 |