Micro electronic systems via multifunctional additive manufacturing

Li, J, Wasley, T, Ta, D et al. (7 more authors) (2018) Micro electronic systems via multifunctional additive manufacturing. Rapid Prototyping Journal, 24 (4). pp. 752-763. ISSN 1355-2546

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Item Type: Article
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© 2018, Emerald Publishing Limited . This is an author produced version of a paper published in Rapid Prototyping Journal. Uploaded in accordance with the publisher's self-archiving policy.

Keywords: Additive manufacturing; DLP stereolithography; Flip chip packaging; Material dispensing; Multilayer embedded electronics; Process integration
Dates:
  • Published: April 2018
  • Published (online): 13 April 2018
  • Accepted: 15 June 2017
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds)
Funding Information:
Funder
Grant number
EPSRC
EP/L017415/1
Depositing User: Symplectic Publications
Date Deposited: 03 Nov 2017 16:33
Last Modified: 24 Jul 2018 14:05
Status: Published
Publisher: Emerald
Identification Number: 10.1108/RPJ-02-2017-0033
Open Archives Initiative ID (OAI ID):

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