Al-Neama, AF, Kapur, N orcid.org/0000-0003-1041-8390, Summers, J orcid.org/0000-0001-8266-5038 et al. (1 more author) (2017) An experimental and numerical investigation of the use of liquid flow in serpentine microchannels for microelectronics cooling. Applied Thermal Engineering, 116. pp. 709-723. ISSN 1359-4311
Abstract
This paper presents a combined experimental and numerical investigation of single-phase water flow and heat transfer in serpentine rectangular microchannels embedded in a heated copper block. The performance of four different microchannel heat sink (MCHS) configurations are investigated experimentally, the first having an array of straight rectangular microchannels (SRMs), while the other have single (SPSMs), double (DPSMs) and triple path multi-serpentine rectangular microchannels (TPSMs). Three-dimensional conjugate heat transfer models are developed for both laminar and turbulent single-phase water flows in each of these MCHSs and the governing flow and energy equations solved numerically using finite elements. The numerical predictions of pressure drop (∆P) and average Nusselt number (〖Nu〗_avg) are in good agreement with experimental data, and indicated that the single path serpentine microchannel (SPSM) leads to a 35% enhancement of the 〖Nu〗_avg at a volumetric flow rate of 0.5 l/min and a 19% reduction in total thermal resistance (R_th) compared to the conventional SRM heat sink. However, this enhancement is at the expense of a large (up to ten-fold) increase in ∆P compared to the SRM heat sink, so that a suitable compromise must be struck between heat transfer and pressure drop in practical MCHS designs.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2017 Elsevier Ltd. This is an author produced version of a paper published in Applied Thermal Engineering. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Experiments, Conjugate Heat Transfer, CFD, Serpentine MCHS |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Engineering Thermofluids, Surfaces & Interfaces (iETSI) (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 07 Feb 2017 14:23 |
Last Modified: | 02 Feb 2018 01:38 |
Published Version: | https://doi.org/10.1016/j.applthermaleng.2017.02.0... |
Status: | Published |
Publisher: | Elsevier |
Identification Number: | 10.1016/j.applthermaleng.2017.02.001 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:111922 |