Bournias-Varotsis, A, Harris, RA orcid.org/0000-0002-3425-7969 and Friel, RJ (2015) The Effect of Ultrasonic Excitation on the Electrical Properties and Microstructure of Printed Electronic Conductive Inks. In: Proceedings. 2015 38th International Spring Seminar on Electronics Technology (ISSE), 06-10 May 2015, Eger, Hungary. IEEE , pp. 140-145. ISBN 978-1-4799-8860-0
Abstract
Abstract: Ultrasonic Additive Manufacturing (UAM) is an advanced manufacturing technique, which enables the embedding of electronic components and interconnections within solid aluminium structures, due to the low temperature encountered during material bonding. In this study, the effects of ultrasonic excitation, caused by the UAM process, on the electrical properties and the microstructure of thermally cured screen printed silver conductive inks were investigated. The electrical resistance and the dimensions of the samples were measured and compared before and after the ultrasonic excitation. The microstructure of excited and unexcited samples was examined using combined Focused Ion Beam and Scanning Electron Microscopy (FIB/SEM) and optical microscopy. The results showed an increase in the resistivity of the silver tracks after the ultrasonic excitation, which was correlated with a change in the microstructure: the size of the silver particles increased after the excitation, suggesting that inter-particle bonding has occurred. The study also highlighted issues with short circuiting between the conductive tracks and the aluminium substrate, which were attributed to the properties of the insulating layer and the inherent roughness of the UAM substrate. However, the reduction in conductivity and observed short circuiting were sufficiently small and rare, which leads to the conclusion that printed conductive tracks can function as interconnects in conjunction with UAM, for the fabrication of novel smart metal components.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2015 IEEE. This is an author produced version of a paper published in 2015 38th International Spring Seminar on Electronics Technology (ISSE). Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Uploaded in accordance with the publisher's self-archiving policy. |
Keywords: | Insulation life, Degradation, Conductivity, Acoustics, Silver, Aluminum, Substrates |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Institute of Medical and Biological Engineering (iMBE) (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 25 Oct 2016 08:43 |
Last Modified: | 17 Jan 2018 07:09 |
Published Version: | https://doi.org/10.1109/ISSE.2015.7247978 |
Status: | Published |
Publisher: | IEEE |
Identification Number: | 10.1109/ISSE.2015.7247978 |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:101751 |