Extreme environment interconnects and packaging for power electronics

Campos-Zatarain, A, Hinton, J, Mirgkizoudi, M et al. (4 more authors) (2019) Extreme environment interconnects and packaging for power electronics. Journal of Engineering, 2019 (17). pp. 4226-4230. ISSN 2051-3305



Copyright, Publisher and Additional Information: This is an open access article under the terms of the Creative Commons Attribution License (CC-BY 3.0), which permits unrestricted use, distribution and reproduction in any medium, provided the original work is properly cited. To view a copy of this license, visit http://creativecommons.org/licenses/by/3.0/.
Keywords: extrusion; printing; integrated circuit bonding; three-dimensional printing; integrated circuit packaging; microfabrication; assembling; copper alloys; power semiconductor devices; high random frequency vibrations; microextrusion printing methods; power electronics; bond strength; solid liquid inter diffusion; packaging; micro-extrusion printing methods; Cu-Sn; Cu-Sn
  • Accepted: 27 July 2018
  • Published (online): 15 April 2019
  • Published: 1 June 2019
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 06 Aug 2019 10:41
Last Modified: 06 Aug 2019 10:41
Status: Published
Publisher: Institute of Engineering and Technology
Identification Number: https://doi.org/10.1049/joe.2018.8118
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