Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

Ryspayeva, A, Jones, TDA, Nekouie Esfahani, M et al. (5 more authors) (2019) Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite. IEEE Transactions on Electron Devices, 66 (4). pp. 1843-1848. ISSN 0018-9383

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Copyright, Publisher and Additional Information: This work is licensed under a Creative Commons Attribution 3.0 License. For more information, see https://creativecommons.org/licenses/by/3.0/
Keywords: Ag nanoparticles (NPs) seeds; electroless copper; metallization of nonconductive surfaces; polymer/Ag nanocomposite
Dates:
  • Published: April 2019
  • Accepted: 29 January 2019
  • Published (online): 15 February 2019
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 17 Apr 2019 14:18
Last Modified: 17 Apr 2019 14:18
Status: Published
Publisher: IEEE
Identification Number: https://doi.org/10.1109/TED.2019.2897258
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