Hybrid additive manufacturing of 3D electronic systems

Li, J, Wasley, T, Nguyen, TT et al. (7 more authors) (2016) Hybrid additive manufacturing of 3D electronic systems. Journal of Micromechanics and Microengineering, 26 (10). 105005. ISSN 0960-1317



Copyright, Publisher and Additional Information: © 2016 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Journal of Micromechanics and Microengineering. The publisher is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at https://doi.org/10.1088/0960-1317/26/10/105005. Uploaded in accordance with the publisher's self-archiving policy.
  • Accepted: 28 June 2016
  • Published (online): 23 August 2016
  • Published: October 2016
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Mechanical Engineering (Leeds) > Future Manufacturing Processes (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 21 Nov 2016 11:22
Last Modified: 13 Oct 2020 22:02
Published Version: https://doi.org/10.1088/0960-1317/26/10/105005
Status: Published
Publisher: IOP Publishing
Identification Number: https://doi.org/10.1088/0960-1317/26/10/105005