Items where authors include "Weiss, JR"

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Number of items: 8.

Article

Ou, Q, Daout, S, Weiss, JR et al. (4 more authors) (2022) Large-Scale Interseismic Strain Mapping of the NE Tibetan Plateau From Sentinel-1 Interferometry. Journal of Geophysical Research: Solid Earth, 127 (6). e2022JB024176. ISSN 2169-9313

Weiss, JR, Walters, RJ, Morishita, Y et al. (12 more authors) (2020) High‐resolution surface velocities and strain for Anatolia from Sentinel‐1 InSAR and GNSS data. Geophysical Research Letters, 47 (17). e2020GL087376. ISSN 0094-8276

Lazecký, M, Spaans, K, González, PJ et al. (13 more authors) (2020) LiCSAR: An Automatic InSAR Tool for Measuring and Monitoring Tectonic and Volcanic Activity. Remote Sensing, 12 (15). 2430. ISSN 2072-4292

Morishita, Y, Lazecky, M, Wright, TJ orcid.org/0000-0001-8338-5935 et al. (3 more authors) (2020) LiCSBAS: An Open-Source InSAR Time Series Analysis Package Integrated with the LiCSAR Automated Sentinel-1 InSAR Processor. Remote Sensing, 12 (3). 424. ISSN 2072-4292

Weiss, JR, Qiu, Q, Barbot, S et al. (14 more authors) (2019) Illuminating subduction zone rheological properties in the wake of a giant earthquake. Science Advances, 5 (12). eaax6720. ISSN 2375-2548

Weiss, JR orcid.org/0000-0002-5142-5135, Ito, G, Brooks, BA et al. (3 more authors) (2018) Formation of the frontal thrust zone of accretionary wedges. Earth and Planetary Science Letters, 495. pp. 87-100. ISSN 0012-821X

Weiss, JR, Brooks, BA, Foster, JH et al. (9 more authors) (2016) Isolating active orogenic wedge deformation in the southern Subandes of Bolivia. Journal of Geophysical Research: Solid Earth, 121 (8). pp. 6192-6218. ISSN 2169-9356

Proceedings Paper

Hooper, A orcid.org/0000-0003-4244-6652, Wright, TJ orcid.org/0000-0001-8338-5935, Spaans, K et al. (12 more authors) (2018) Global Monitoring of Fault Zones and Volcanoes with Sentinel-1. In: Observing, Understanding And Forecasting The Dynamics Of Our Planet. IEEE International Geoscience and Remote Sensing Symposium (IGARSS 2018), 22-27 Jul 2018, Valencia, Spain. IEEE , pp. 1566-1568. ISBN 978-1-5386-7150-4

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