Items where authors include "Robinson, Martin P."
Article
Xie, Haiyan, Dawson, John F. orcid.org/0000-0003-4537-9977, Marvin, Andy C. orcid.org/0000-0003-2590-5335 et al. (1 more author) (2020) Numerical and theoretical analysis of stochastic electromagnetic fields coupling to a printed circuit board trace. IEEE Transactions on Electromagnetic Compatibility. pp. 1128-1135. ISSN 0018-9375
Yan, Jiexiong, Dawson, John F. orcid.org/0000-0003-4537-9977, Marvin, Andy C. orcid.org/0000-0003-2590-5335 et al. (2 more authors) (2019) 3D Diffusion Models for Predicting Reverberant Electromagnetic Fields in Loaded Enclosures. IEEE Transactions on Electromagnetic Compatibility. pp. 1362-1369. ISSN 0018-9375
Zhang, Xiaotian, Robinson, Martin P. orcid.org/0000-0003-1767-5541, Flintoft, Ian D. orcid.org/0000-0003-3153-8447 et al. (1 more author) (2018) Efficient Determination of Reverberation Chamber Time Constant. IEEE Transactions on Electromagnetic Compatibility. pp. 1296-1303. ISSN 0018-9375
Proceedings Paper
Ghaffarlouy Raef, Ali orcid.org/0000-0002-2799-0505, Marvin, Andrew C. orcid.org/0000-0003-2590-5335, Bale, Simon et al. (2 more authors) (2024) Enhanced Prediction and Measurement of the Shielding Effectiveness of Reverberant Equipment Enclosures. In: EMC Europe 2024. UNSPECIFIED. EMC Europe . .
Hunasanahalli Venkateshaiah, Arunkumar orcid.org/0000-0002-3505-1970, Xie, Haiyan, Dawson, John F. orcid.org/0000-0003-4537-9977 et al. (3 more authors) (2020) Coupling of Energy Into PCB Traces in a Reverberant Environment: Absorption Cross-section and Probability of Susceptibility. In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE. UNSPECIFIED. EMC Europe . .
Aurand, Tobias, Dawson, John F. orcid.org/0000-0003-4537-9977, Robinson, Martin P. orcid.org/0000-0003-1767-5541 et al. (1 more author) (2008) Applying IEC 62132-2 to the real world: Immunity of an analogue to digital converter. In: 2008 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC EUROPE). UNSPECIFIED. , Hamburg, Germany , pp. 477-480.