Items where authors include "Palczewska, A"
Article
Keen, J orcid.org/0000-0003-2753-8276, Ruddle, R, Palczewski, J et al. (4 more authors) (2020) Machine learning, materiality and governance: A health and social care case study. Information Polity. ISSN 1570-1255
Marchese Robinson, RL, Palczewska, A, Palczewski, JA orcid.org/0000-0003-0235-8746 et al. (1 more author) (2017) Comparison of the Predictive Performance and Interpretability of Random Forest and Linear Models on Benchmark Datasets. Journal of Chemical Information and Modeling, 57 (8). pp. 1773-1792. ISSN 1549-9596
Cassano, A, Robinson, RLM, Palczewska, A et al. (5 more authors) (2016) Comparing the CORAL and Random Forest Approaches for Modelling the In Vitro Cytotoxicity of Silica Nanomaterials. ATLA Alternatives to Laboratory Animals, 44 (6). pp. 533-556. ISSN 0261-1929
Proceedings Paper
Keen, J orcid.org/0000-0003-2753-8276, Ruddle, R, Palczewski, J orcid.org/0000-0003-0235-8746 et al. (4 more authors) (2019) Public services, personal data and machine learning: prospects for infrastructures and ecosystems. In: Kaya, T, (ed.) 19th European Conference on Digital Government (ECDG 2019). European Conference on Digital Government, 24-25 Oct 2019, Nicosia, Cyprus. Academic Conferences Ltd . ISBN 9781510899018
Palczewska, A, Palczewski, J orcid.org/0000-0003-0235-8746, Aivaliotis, G et al. (1 more author) (2017) RobustSPAM for Inference from Noisy Longitudinal Data and Preservation of Privacy. In: IEEE ICMLA 2017 Conference proceedings. IEEE 16TH International Conference on Machine Learning and Applications - ICMLA 2017, 18-21 Dec 2017, Cancun, Mexico. Institute of Electrical and Electronics Engineers , pp. 344-351. ISBN 978-1-5386-1417-4
Palczewska, A, Palczewski, J, Robinson, RM et al. (1 more author) (2013) Interpreting random forest models using a feature contribution method. In: Information Reuse and Integration (IRI), 2013 IEEE 14th International Conference on. 2013 IEEE 14th International Conference on Information Reuse and Integration, 14-16 Aug 2013, San Francisco, CA, USA. IEEE , 112-119 .