Items where authors include "Oberhammer, J"

Article

Bleiker, S, Fischer, A, Shah, A et al. (6 more authors) (2015) High-aspect-ratio through silicon vias (TSVs) for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (1). 21 - 27. ISSN 2156-3950

Proceedings Paper

Viratikul, R, Boonlom, K, Mancinelli, E et al. (7 more authors) (2022) Electromagnetic Property Characterization and Sensing of Endothelial Cells Growth Medium and Dulbecco's Phosphate Buffered Saline Solution for in vitro Cell Culture. In: 2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON). 2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), 24-27 May 2022, Prachuap Khiri Khan, Thailand. IEEE . ISBN 978-1-6654-8585-2

Oberhammer, J, Shah, U, Baghchehsaraei, Z et al. (4 more authors) (2013) Monocrystalline-Silicon Microwave MEMS. In: UNSPECIFIED Progress in Electromagnetics Research Symposium PIERS 2013, 12-15 Aug 2013, Stockholm, Sweden. The Electromagnetics Academy , 1933 - 1941.