Items where authors include "Moore, T.A."

Article

Moore, T.A. orcid.org/0000-0001-6443-2556 (2025) Magnetic domain wall and skyrmion manipulation by static and dynamic strain profiles. Nanotechnology, 36 (7). 072003. ISSN 0957-4484

Shui, J. orcid.org/0000-0002-6114-6711, Lopez-Diaz, L. orcid.org/0000-0002-9773-1875, Cunningham, J.E. orcid.org/0000-0002-1805-9743 et al. (1 more author) (2024) Transport of skyrmions by surface acoustic waves. Applied Physics Letters, 124 (20). 202407. ISSN 0003-6951

Marrows, C.H. orcid.org/0000-0003-4812-6393, Barker, J., Moore, T.A. et al. (1 more author) (2024) Neuromorphic Computing with Spintronics. npj Spintronics, 2. 12. ISSN 2948-2119

Barker, C.E.A orcid.org/0000-0001-7266-3223, Fallon, K. orcid.org/0009-0003-8176-3615, Barton, C. orcid.org/0000-0003-4366-5726 et al. (12 more authors) (2024) Phase coexistence and transitions between antiferromagnetic and ferromagnetic states in a synthetic antiferromagnet. Physical Review B: Condensed Matter and Materials Physics, 109 (13). 134437. ISSN 2469-9950

Shuai, J. orcid.org/0000-0002-6114-6711, Lopez-Diaz, L. orcid.org/0000-0002-9773-1875, Cunningham, J.E. orcid.org/0000-0002-1805-9743 et al. (1 more author) (2023) Surface acoustic wave effect on magnetic domain wall dynamics. Physical Review B, 108 (10). 104420. ISSN 2469-9950

Hunt, R.G. orcid.org/0000-0001-7350-3571, Franke, K.J.A. orcid.org/0000-0001-9089-9571, Keatley, P.S. orcid.org/0000-0002-7679-6418 et al. (3 more authors) (2023) Temperature dependence of magnetic anisotropy and domain wall tuning in BaTiO₃(111)/CoFeB multiferroics. APL Materials, 11 (7). 071112. ISSN 2166-532X

Proceedings Paper

Hunt, R.G., Franke, K.J.A., Keatley, P.S. et al. (2 more authors) (2023) Temperature Dependence of Magnetic Anisotropy and Domain Wall Width Tuning in a BaTiO₃(111)/CoFeB Heterostructure. In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers) Proceedings. 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers), 15-19 May 2023, Sendai, Japan. IEEE . ISBN 9798350338362