Items where authors include "Dai, Y."

Article

Du, M., Brean, J., Worsnop, D.R. et al. (25 more authors) (2026) Arctic cloud condensation nuclei enhanced by iodine, sulfur and organic precursors. Nature Geoscience, 19. pp. 1039-1046. ISSN 1752-0894

Pu, K., Yang, S., Sheng, R. et al. (5 more authors) (2025) Chuanxiong-Danggui herb pair alleviated cognitive deficits of APP/PS1 mice by promoting mitophagy. Journal of Ethnopharmacology, 350. 119988. ISSN 0378-8741

Das, S. orcid.org/0000-0002-2313-2183, Uddin, M.G., Li, D. et al. (6 more authors) (2025) Nanoscale thickness Octave-spanning coherent supercontinuum light generation. Light: Science & Applications, 14 (1). 41. ISSN 2095-5545

Zhao, W., Dai, Y., You, Y. et al. (3 more authors) (2024) Efficient Data Transmission With Compressed Channel Estimation in RIS-Assisted mmWave MIMO Systems. IEEE Wireless Communications Letters, 13 (11). pp. 2965-2969. ISSN 2162-2337

Dai, Y., Susmel, L. orcid.org/0000-0001-7753-9176 and Qin, F. (2020) Sharp V-notches in viscoplastic solids: strain energy rate density rule and fracture toughness. Fatigue and Fracture of Engineering Materials and Structures, 44 (1). pp. 28-42. ISSN 1460-2695

Conference or Workshop Item

Dai, Y., Lim, H.W., Connor-Crabb, A. et al. (1 more author) (2025) Exploring the Digital Body in Fashion Design: A Theoretical Inquiry into New Aesthetics and Form. In: 2nd Smart Wearables & Digital Fashion Congress (SWDFC), 28-30 Apr 2025, Manchester, UK.

Conference abstract

Dai, Y., Lim, H.W., Crabb, A.C. et al. (1 more author) (2025) Reinterpreting the Fashioned Body: Digital Innovation in Garment Design. [Conference abstract] (In Press)

Proceedings Paper

Peng, J., Fang, J., Liu, J. et al. (5 more authors) (2023) Optimizing MPI Collectives on Shared Memory Multi-cores. In: Proceedings of SC23: The International Conference for High Performance Computing, Networking, Storage, and Analysis. SC23: The International Conference for High Performance Computing, Networking, Storage, and Analysis, 12-17 Nov 2023, Denver, USA. ACM . ISBN 9798400701092