Items where authors include "Aasmundtveit, KE"

Proceedings Paper

Campos-Zatarain, A, Flynn, D, Aasmundtveit, KE et al. (6 more authors) (2014) Characterization of Cu-Sn SLID interconnects for harsh environment applications. In: DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. DTIP 2014, 02-04 Apr 2014, Côte d’Azur, France. IEEE . ISBN 9782355000287