Samanta, KK and Robertson, ID (2014) High Performance Compact Multilayer Circular Spiral Inductors in Advanced Photoimageable Technology. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 4 (12). pp. 1981-1988. ISSN 2156-3950
Abstract
This paper presents the development and thorough analysis of a wide range of coplanar-waveguide circular spiral inductors with remarkably high performance and inductance density using advanced multilayer (ML) photoimageable thick-film (Pimage-TF) multichip module (MCM) technology. The performances of the embedded spiral inductors are thoroughly analyzed, modeled, and compared with the competitive MCM technologies and are superior to most of the published results. A new design and layout generation technique with a simplified closed form expression for circular spiral inductors is proposed. Moreover, the impact of MCM/system-on-package technologies on inductor key parameters has been explained in detail and compared with other technologies. The cost-effective Pimage-TF-based inductors demonstrate the highest level of self-resonance frequency, as well as inductance density (15 nH/$mathrm{mm}^{mathrm {mathbf {2}}}$ ) reported to date in conventional thick-film-based ML MCM technologies, including low temperature cofired ceramic.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2014 IEEE. This is an author produced version of a paper published in IEEE Transactions on Components, Packaging, and Manufacturing Technology. Uploaded in accordance with the publisher's self-archiving policy. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. |
Keywords: | Miniaturized inductor; multichip modules (MCM); mutilayer (ML) passive components; photoimageable |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Pollard Institute (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 15 Jun 2016 11:00 |
Last Modified: | 15 Jan 2018 18:11 |
Published Version: | https://dx.doi.org/10.1109/TCPMT.2014.2363819 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Identification Number: | 10.1109/TCPMT.2014.2363819 |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:97343 |