Real-time temperature estimation in a multiple device power electronics system subject to dynamic cooling

This paper presents a technique to estimate the temperature of each power electronic device in a thermally coupled, multiple device system subject to dynamic cooling. Using a demonstrator system, the thermal transfer impedance between pairs of devices is determined in the frequency domain for a quantised range of active cooling levels using a technique based on pseudorandom binary sequences. The technique is illustrated by application to the case temperatures of power devices. For each cooling level and pair of devices, a sixth order digital IIR filter is produced which can be used to directly estimate temperature from device input power. When the cooling level changes, the filters in use are substituted and the internal states of the old filters are converted for use in the new filter. Two methods for filter state conversion are developed—a computationally efficient method which is suited to infrequent changes in power dissipation and cooling, and a more accurate method which requires increased memory and processing capacity. Results show that the temperature can be estimated with low error using a system which is suitable for integration on an embedded processor.