Bleiker, S, Fischer, A, Shah, A et al. (6 more authors) (2015) High-aspect-ratio through silicon vias (TSVs) for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (1). 21 - 27. ISSN 2156-3950
Abstract
In this paper we demonstrate a novel manufacturing technology for high-aspect-ratio vertical interconnects for highfrequency applications. This novel approach is based on magnetic self-assembly of pre-fabricated nickel wires that are subsequently insulated with a thermosetting polymer. The high-frequency performance of the through silicon vias (TSVs) is enhanced by depositing a gold layer on the outer surface of the nickel wires and by reducing capacitive parasitics through a low-k polymer liner. As compared to conventional TSV designs, this novel concept offers a more compact design and a simpler, potentially more cost-effective manufacturing process. Moreover, this fabrication concept is very versatile and adaptable to many different applications such as interposer, MEMS, or millimeter wave applications. For evaluation purposes, coplanar waveguides (CPW) with incorporated TSV interconnections were fabricated and characterized. The experimental results reveal a high bandwidth from DC to 86 GHz and an insertion loss of less than 0.53 dB per single TSV interconnection for frequencies up to 75 GHz.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Editors: |
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Copyright, Publisher and Additional Information: | © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works |
Keywords: | Packaging; Electronics; 3D Integration; RF signal transmission; wafer scale integration |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Pollard Institute (Leeds) |
Depositing User: | Symplectic Publications |
Date Deposited: | 23 Oct 2014 14:58 |
Last Modified: | 24 Oct 2015 17:29 |
Published Version: | http://dx.doi.org/10.1109/TCPMT.2014.2369236 |
Status: | Published |
Publisher: | Institute of Electrical and Electronics Engineers |
Identification Number: | 10.1109/TCPMT.2014.2369236 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:80350 |