Application of strain tomography and contour method to residual stress analysis in additively manufactured CM247LC superalloy parts

Uzun, F., Slim, M.F., Basoalto, H. et al. (3 more authors) (2025) Application of strain tomography and contour method to residual stress analysis in additively manufactured CM247LC superalloy parts. Progress in Additive Manufacturing, 10 (10). pp. 8279-8291. ISSN: 2363-9512

Abstract

Metadata

Item Type: Article
Authors/Creators:
  • Uzun, F.
  • Slim, M.F.
  • Basoalto, H.
  • Liogas, K.
  • Wang, Z.I.
  • Korsunsky, A.M.
Copyright, Publisher and Additional Information:

© The Author(s) 2025. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

Keywords: Residual stress reconstruction; Synchrotron X-ray diffraction; Elastic strain mapping; Finite element analysis; Laser powder bed fusion; High-temperature superalloys
Dates:
  • Submitted: 8 February 2025
  • Accepted: 6 April 2025
  • Published (online): 23 April 2025
  • Published: October 2025
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > School of Chemical, Materials and Biological Engineering
Date Deposited: 06 Oct 2025 13:30
Last Modified: 06 Oct 2025 13:30
Status: Published
Publisher: Springer Science and Business Media LLC
Refereed: Yes
Identification Number: 10.1007/s40964-025-01116-2
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Open Archives Initiative ID (OAI ID):

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