An innovative patternable microelectrode bonding technology for high-performance and cost-effective sealing in microfluidic chips

Zhao, B., Kontziampasis, D. orcid.org/0000-0002-6787-8892, Huang, L. et al. (2 more authors) (2025) An innovative patternable microelectrode bonding technology for high-performance and cost-effective sealing in microfluidic chips. Chemical Engineering Journal, 503. 158214. ISSN 1385-8947

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Item Type: Article
Authors/Creators:
Copyright, Publisher and Additional Information:

This is an author produced version of an article published in Chemical Engineering Journal, made available under the terms of the Creative Commons Attribution License (CC-BY), which permits unrestricted use, distribution and reproduction in any medium, provided the original work is properly cited.

Keywords: Microfluidics; Microfabrication; Bonding technology; Polymers; Sealing; Microelectrode bonding
Dates:
  • Published: 1 January 2025
  • Published (online): 2 December 2024
  • Accepted: 1 December 2024
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > SWJTU Joint School (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 10 Dec 2024 17:34
Last Modified: 20 Dec 2024 14:17
Status: Published
Publisher: Elsevier
Identification Number: 10.1016/j.cej.2024.158214
Open Archives Initiative ID (OAI ID):

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