This paper introduces a Curved Hollow Substrate Integrated Waveguide (CHSIW) to address the growing demand for millimeter-wave applications, including communication, sensing, imaging, radar, and wireless power transfer systems. Leveraging advancements in integrated circuits and system-in-package (SiP) technology, the CHSIW tackles the challenges associated with hardware integration into curved structures. The design utilizes MultiJet Printing (MJP) for the M3 crystal dielectric substrate and a water laser cutter system for copper sheets, streamlining the fabrication process by eliminating complex via manufacturing steps through prefabricated through-hole vias. Operating in the frequency range of 21.7 GHz to 32 GHz, the CHSIW exhibits outstanding performance on curved surfaces, with measured average attenuation constants of 1.89 Np/m (16.42 dB/m) and 1.95 Np/m (16.94 dB/m) for samples with radii of curvature of 166.8 mm and 125.1 mm, respectively. Beyond addressing technical challenges, the CHSIW presents a cost-effective and simplified fabrication process, positioning it as a breakthrough solution for diverse millimeter-wave applications, including future robotic and UAV communications. Furthermore, the proposed design and fabrication technique hold promise for the realization of conformal and free-form Hollow Substrate Integrated Waveguide (HSIW) devices in the future.
CORE (COnnecting REpositories)
CORE (COnnecting REpositories)