Savvides, G, Duangrit, N, Chudpooti, N et al. (3 more authors) (2021) Novel Hollow Substrate Integrated Waveguide for 5G and Robotic Applications. In: 2021 Research, Invention, and Innovation Congress: Innovation Electricals and Electronics (RI2C). 2021 Research, Invention, and Innovation Congress: Innovation Electricals and Electronics (RI2C), 01-03 Sep 2021, Bangkok, Thailand. IEEE , pp. 119-122. ISBN 978-1-6654-0300-9
Abstract
This paper presents, a novel design of a Hollow Substrate Integrated Waveguide (HSIW), that is built by using both Subtractive and Additive Manufacturing technologies. Specifically, it utilizes Polymer jetting method to print an Acrylonitrile butadiene styrene (ABS) dielectric substrate and a water laser cutter system to produce smooth copper sheets as the top and bottom enclosures of the HSIW. Also, the fabrication process is utilizing mechanical through hole plating of commercially available prefabricated vias, eliminating the cost and complexity of performing vias fabrication and metallization process as in other SIW designs. The proposed waveguide covers 5G new radio frequency bands, specifically from 21 GHz to 31 GHz. It has a simulated and a measured attenuation constant of 0.636 Np/m and 1.56 Np/m respectively, for the whole operating frequency range and is among the lowest reported values to date. The proposed HSIW of this paper, can be compared with other state- of-the-art designs in terms of compactness, manufacturing cost and performance. The designed HSIW can be integrated with other planar circuits and can be used to build functional devices such as antennas or filters for 5G, robotics and IoT applications.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Keywords: | component, formatting, style, styling, insert |
Dates: |
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Institution: | The University of Leeds |
Academic Units: | The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Pollard Institute (Leeds) |
Funding Information: | Funder Grant number EPSRC (Engineering and Physical Sciences Research Council) EP/N010523/1 |
Depositing User: | Symplectic Publications |
Date Deposited: | 22 Oct 2021 10:21 |
Last Modified: | 26 Oct 2021 15:04 |
Status: | Published |
Publisher: | IEEE |
Identification Number: | 10.1109/ri2c51727.2021.9559806 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:179476 |