Tang, Hui, Venkateshaiah, Arunkumar H. orcid.org/0000-0002-3505-1970, Dawson, John F. orcid.org/0000-0003-4537-9977 et al. (3 more authors) (Accepted: 2021) Analysis and Estimation of Electromagnetic Energy Coupled into IC packages. In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe. (In Press)
Abstract
Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | Submitted 16/03/21, Accepted 4/5/2021 |
Keywords: | EMC,EMI,Electromagnetic Susceptibility,Absorption cross section |
Dates: |
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Institution: | The University of York |
Academic Units: | The University of York > Faculty of Sciences (York) > Electronic Engineering (York) |
Funding Information: | Funder Grant number EUROPEAN COMMISSION 812790 |
Depositing User: | Pure (York) |
Date Deposited: | 04 May 2021 11:50 |
Last Modified: | 02 Apr 2025 23:33 |
Status: | In Press |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:173677 |
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