Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Tang, Hui, Venkateshaiah, Arunkumar H. orcid.org/0000-0002-3505-1970, Dawson, John F. orcid.org/0000-0003-4537-9977 et al. (3 more authors) (Accepted: 2021) Analysis and Estimation of Electromagnetic Energy Coupled into IC packages. In: Joint IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity and EMC Europe. (In Press)

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Item Type: Proceedings Paper
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Submitted 16/03/21, Accepted 4/5/2021

Keywords: EMC,EMI,Electromagnetic Susceptibility,Absorption cross section
Dates:
  • Accepted: 4 May 2021
Institution: The University of York
Academic Units: The University of York > Faculty of Sciences (York) > Electronic Engineering (York)
Funding Information:
Funder
Grant number
EUROPEAN COMMISSION
812790
Depositing User: Pure (York)
Date Deposited: 04 May 2021 11:50
Last Modified: 02 Apr 2025 23:33
Status: In Press
Open Archives Initiative ID (OAI ID):

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