He, H., Huang, S., Ye, Y. et al. (4 more authors) (2020) Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam. Journal of Alloys and Compounds, 845. 156240. ISSN 0925-8388
Abstract
In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times. The tensile strength of pure Sn solder was improved significantly by the addition of metal foams, and the Cu-Ni alloy/Sn composite solder exhibited the highest tensile strength of 50.32 MPa. The skeleton networks of the foams were gradually dissolved into the soldering seam with increasing soldering time, accompanied by the massive formation of (Cu,Ni)6Sn5 phase in the joint. The dissolution rates of Ni foam, Cu coated Ni foam and Cu-Ni alloy foams into the Sn matrix increased successively during soldering. An increased dissolution rate of the metal foam leads to an increase in the Ni content in the soldering seam, which was found to be beneficial in refining the (Cu,Ni)6Sn5 phase and inhibiting the formation of the Cu3Sn IMC layer on the Cu substrate surface. The average shear strength of the Cu joints was improved with increasing soldering time, and a shear strength of 61.2 MPa was obtained for Cu joints soldered with Cu-Ni alloy/Sn composite solder for 60 min.
Metadata
Item Type: | Article |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2020 Elsevier B.V. This is an author produced version of a paper subsequently published in Journal of Alloys and Compounds. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/). |
Keywords: | Cu interconnects; Metal foams; Sn-based solder; Microstructure; Mechanical properties |
Dates: |
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Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield) |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 12 Feb 2021 11:29 |
Last Modified: | 02 Jul 2021 00:38 |
Status: | Published |
Publisher: | Elsevier BV |
Refereed: | Yes |
Identification Number: | 10.1016/j.jallcom.2020.156240 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:171039 |