Way, M., Luo, D., Tuley, R. et al. (1 more author) (2021) A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper. Journal of Alloys and Compounds, 858. 157750. ISSN 0925-8388
Abstract
A new High Entropy Alloy (HEA) in the ZnGaCu-(AuSn) system was designed to join skutterudite thermoelectrics (CoSb2.75Sn0.05Te0.20), with a diffusion barrier of Ni applied, to Cu. Such a joint could be part of a device for thermal energy recovery within automotive exhaust systems. A rapid large-scale screening calculation technique based on Python programming has been introduced to conduct the HEA selection process, resulting in a series of alloys, which have been experimentally verified. It is demonstrated that a particular ZnGaCu-(AuSn) HEA alloy can join Ni and Cu successfully; a good joint is formed, and the average electrical contact resistance of the interfaces after joining is promising at room temperature, which shows that it has the potential to improve on the existing fillers used in such applications. The alloy design methodology used here suggests a potential efficient route to design new filler metals for a wide array of applications in which existing filler metals are not suitable.
Metadata
Item Type: | Article |
---|---|
Authors/Creators: |
|
Copyright, Publisher and Additional Information: | © 2020 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/). |
Keywords: | Brazing filler metal; High entropy alloy design; Thermoelectrics; Gallium; Metal joining; Python programming |
Dates: |
|
Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield) |
Funding Information: | Funder Grant number Engineering and Physical Sciences Research Council EP/S032169/1 |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 09 Nov 2020 15:57 |
Last Modified: | 04 Feb 2022 14:19 |
Status: | Published |
Publisher: | Elsevier BV |
Refereed: | Yes |
Identification Number: | 10.1016/j.jallcom.2020.157750 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:167726 |