Raab, O., Guacci, M., Griffo, A. orcid.org/0000-0001-5642-2921 et al. (6 more authors) (2020) Full-SiC integrated power module based on planar packaging technology for high efficiency power converters in aircraft applications. In: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems. 11th International Conference on Integrated Power Electronics Systems, 24-26 Mar 2020, Berlin, Germany. VDE ISBN 9783800752256
Abstract
Compact, light-weight, efficient and reliable power converters are fundamental for the future of More Electrical Aircraft (MEA). Core elements supporting the electrification of the aerospace industry are power modules (PMs) employing exclusively SiC MOSFETs. In order to fully exploit the high switching speeds enabled by SiC, and to address the challenges arising from the parallelization of power devices, novel PM concepts must be investigated. In this paper, highly symmetrical layouts, low inductance planar interconnection technologies, and integrated buffer capacitors are explored to realize a high efficiency, fast-switching, and reliable full-SiC PM for MEA applications. A comprehensive assessment of a number of performance metrics against state-of-the-art full-SiC PMs demonstrates the benefits of the proposed design approach and manufacturing technologies. Moreover, by integrating temperature and current sensors, intelligent functions, which are crucial for the safe application of power electronics in MEA, are added to the developed PM. In this context, the use of MOSFETs’ Temperature Sensitive Electrical Parameters for online junction temperature estimation is demonstrated, allowing for non-invasive, i.e. without the need for dedicated sensors, thermal monitoring. Additionally, a highly compact gate driver, reducing the overall system volume and complexity, is designed and integrated in the housing of the PM. Finally, switching waveforms are measured during operation of the PM at 500V and 200A, proving the performance improvement enabled by the low inductance layout, the integrated snubber, and the gate driver.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2020 The Authors and VDE Verlag GMBH. |
Dates: |
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Institution: | The University of Sheffield |
Academic Units: | The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Electronic and Electrical Engineering (Sheffield) |
Funding Information: | Funder Grant number European Commission - Horizon 2020 I2MPECT - 636170 |
Depositing User: | Symplectic Sheffield |
Date Deposited: | 17 Dec 2019 15:05 |
Last Modified: | 24 Jun 2020 13:48 |
Published Version: | https://ieeexplore.ieee.org/document/9097673 |
Status: | Published |
Publisher: | VDE |
Refereed: | Yes |
Related URLs: | |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:154712 |