Characterization of Cu-Sn SLID interconnects for harsh environment applications
Campos-Zatarain, A, Flynn, D, Aasmundtveit, KE et al. (6 more authors)
(2014)
Characterization of Cu-Sn SLID interconnects for harsh environment applications.
In:
DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
DTIP 2014, 02-04 Apr 2014, Côte d’Azur, France.
IEEE
ISBN 9782355000287
Abstract
This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.
Metadata
Item Type:
Proceedings Paper
Authors/Creators:
Campos-Zatarain, A
Flynn, D
Aasmundtveit, KE
Hoivik, N
Wang, K
Liu, H
Luu, TT
Mirgkizoudi, M
Kay, RW
Copyright, Publisher and Additional Information:
(c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Keywords:
"shake and bake"; SLID; high-temprature; Cu-Sn; harsh environment; bonding
CORE (COnnecting REpositories)
CORE (COnnecting REpositories)