Parker, S. L., Marvin, A. C. orcid.org/0000-0003-2590-5335, Dawson, J. F. orcid.org/0000-0003-4537-9977 et al. (1 more author) (2017) Measurement of Transmission through Printed Circuit Boards:Application to Enclosure Shielding. In: 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE. EMC Europe 2017, 04-08 Sep 2017 , FRA
Abstract
It is important when considering the shielding effectiveness (SE) of an enclosure to take into account any contents the enclosure may have. Contents such as printed circuit boards (PCBs) will absorb electromagnetic energy and so affect the SE of the enclosure. Previously, it has been shown that the absorption cross section (ACS) of PCBs and the transmission cross section of apertures can be used in the power balance method to predict the SE of simple enclosures. However, in a more realistic enclosure, multiple cavities may be formed by PCBs that cover a large proportion of the enclosure cross section. In this case, the transmission through the PCBs, as well as through the apertures, needs to be considered. In this paper, we describe measuring the transmission through a PCB using a method normally used to measure the SE of planar samples. This measurement is quick and efficient to carry out, as no special preparation of the PCB is required. The results are shown from a selection of PCBs and limitations of the measurement discussed. The data collected can be used in power balance or computational modelling to allow engineers to determine a more accurate estimate of enclosure SE when designing electronic systems.
Metadata
Item Type: | Proceedings Paper |
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Authors/Creators: |
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Copyright, Publisher and Additional Information: | © 2017 IEEE. This is an author-produced version of the published paper. Uploaded in accordance with the publisher’s self-archiving policy. Further copying may not be permitted; contact the publisher for details |
Keywords: | Electromagnetic shielding,Power balance |
Dates: |
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Institution: | The University of York |
Academic Units: | The University of York > Faculty of Sciences (York) > Electronic Engineering (York) |
Funding Information: | Funder Grant number HUAWEI TECHNOLOGIES CO. LTD UNSPECIFIED |
Depositing User: | Pure (York) |
Date Deposited: | 25 Aug 2017 08:45 |
Last Modified: | 21 Jan 2025 18:23 |
Published Version: | https://doi.org/10.1109/EMCEurope.2017.8094643 |
Status: | Published |
Identification Number: | 10.1109/EMCEurope.2017.8094643 |
Open Archives Initiative ID (OAI ID): | oai:eprints.whiterose.ac.uk:120549 |