Patterning of electroless copper deposition on low temperature co-fired ceramic.

Rathnayake-Arachchige, D, Hutt, DA, Conway, PP et al. (4 more authors) (2013) Patterning of electroless copper deposition on low temperature co-fired ceramic. In: Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. Electronics Packaging Technology Conference (EPTC 2013),, 11-13 December 2013, Singapore. IEEE , 630 - 634. ISBN 978-1-4799-2832-3

Abstract

Metadata

Authors/Creators:
  • Rathnayake-Arachchige, D
  • Hutt, DA
  • Conway, PP
  • D'Auria, M
  • Lucyszyn, S
  • Lee, RM
  • Robertson, ID
Keywords: ceramics; copper; electroless deposited coatings; electroless deposition; laser beam machining; metallisation
Dates:
  • Published: December 2013
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Pollard Institute (Leeds)
Depositing User: Symplectic Publications
Date Deposited: 10 Nov 2015 12:33
Last Modified: 10 Nov 2015 12:33
Published Version: http://dx.doi.org/10.1109/EPTC.2013.6745796
Status: Published
Publisher: IEEE
Identification Number: https://doi.org/10.1109/EPTC.2013.6745796

Download not available

A full text copy of this item is not currently available from White Rose Research Online

Share / Export

Statistics