Semisolid heat treatment processing window of Pb-40% Sn alloy for feedstock in the 3D printing thixo-forming process

Alharbi, A., Khan, A., Todd, I. et al. (2 more authors) (2021) Semisolid heat treatment processing window of Pb-40% Sn alloy for feedstock in the 3D printing thixo-forming process. In: Materials Today: Proceedings. 1st International Conference on Computations in Materials and Applied Engineering, 01-02 May 2021, Uttarakhand, India. Elsevier .

Abstract

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Authors/Creators:
Copyright, Publisher and Additional Information: © 2021 Elsevier. This is an author produced version of a paper subsequently published in Materials Today: Proceedings. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/).
Keywords: Semisolid; Heat treatment; Pb-Sn; Alloy; Liquid-Solid; Feedstock
Dates:
  • Accepted: 25 May 2021
  • Published (online): 7 June 2021
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Mechanical Engineering (Sheffield)
Funding Information:
FunderGrant number
Engineering and Physical Science Research CouncilEP/M022218/1
Depositing User: Symplectic Sheffield
Date Deposited: 09 Jun 2021 07:11
Last Modified: 07 Jun 2022 00:38
Status: Published online
Publisher: Elsevier
Refereed: Yes
Identification Number: https://doi.org/10.1016/j.matpr.2021.05.549

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