Increasing the sensitivity of terahertz metamaterials for dielectric sensing by substrate etching

Park, SJ orcid.org/0000-0001-8606-191X, Meng, K, Burnett, AD et al. (12 more authors) (2020) Increasing the sensitivity of terahertz metamaterials for dielectric sensing by substrate etching. In: 2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). 2020 45th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 08-13 Nov 2020, Buffalo, NY, USA. IEEE . ISBN 978-1-7281-6621-6

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Copyright, Publisher and Additional Information: © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Dates:
  • Published: 8 November 2020
  • Accepted: 20 June 2020
  • Published (online): 11 March 2021
Institution: The University of Leeds
Academic Units: The University of Leeds > Faculty of Engineering & Physical Sciences (Leeds) > School of Electronic & Electrical Engineering (Leeds) > Pollard Institute (Leeds)
Funding Information:
FunderGrant number
EPSRC (Engineering and Physical Sciences Research Council)EP/P007449/1
EPSRC (Engineering and Physical Sciences Research Council)EP/P021859/1
EPSRC (Engineering and Physical Sciences Research Council)EP/R00501X/1
Depositing User: Symplectic Publications
Date Deposited: 17 Mar 2021 16:12
Last Modified: 30 Mar 2021 13:42
Status: Published
Publisher: IEEE
Identification Number: https://doi.org/10.1109/irmmw-thz46771.2020.9370679

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