Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam

He, H., Huang, S., Xiao, Y. orcid.org/0000-0002-3194-9214 et al. (1 more author) (2020) Diffusion reaction-induced microstructure and strength evolution of Cu joints bonded with Sn-based solder containing Ni-foam. Materials Letters, 281. 128642. ISSN 0167-577X

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Copyright, Publisher and Additional Information: © 2020 Elsevier B.V. This is an author produced version of a paper subsequently published in Materials Letters. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/).
Keywords: Ni foam/Sn composite solder; Cu joint; Microstructure; Solid state reaction; Intermetallic alloys and compounds
Dates:
  • Accepted: 4 September 2020
  • Published (online): 8 September 2020
  • Published: 15 December 2020
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield)
Funding Information:
FunderGrant number
Engineering and Physical Sciences Research CouncilEP/S032169/1
Depositing User: Symplectic Sheffield
Date Deposited: 12 Feb 2021 11:45
Last Modified: 08 Sep 2021 00:38
Status: Published
Publisher: Elsevier BV
Refereed: Yes
Identification Number: https://doi.org/10.1016/j.matlet.2020.128642
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