Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

He, H., Huang, S., Ye, Y. et al. (4 more authors) (2020) Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam. Journal of Alloys and Compounds, 845. 156240. ISSN 0925-8388

Abstract

Metadata

Authors/Creators:
Copyright, Publisher and Additional Information: © 2020 Elsevier B.V. This is an author produced version of a paper subsequently published in Journal of Alloys and Compounds. Uploaded in accordance with the publisher's self-archiving policy. Article available under the terms of the CC-BY-NC-ND licence (https://creativecommons.org/licenses/by-nc-nd/4.0/).
Keywords: Cu interconnects; Metal foams; Sn-based solder; Microstructure; Mechanical properties
Dates:
  • Accepted: 28 June 2020
  • Published (online): 2 July 2020
  • Published: 10 December 2020
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield)
Depositing User: Symplectic Sheffield
Date Deposited: 12 Feb 2021 11:29
Last Modified: 02 Jul 2021 00:38
Status: Published
Publisher: Elsevier BV
Refereed: Yes
Identification Number: https://doi.org/10.1016/j.jallcom.2020.156240

Download

Share / Export

Statistics