A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper

Way, M., Luo, D., Tuley, R. et al. (1 more author) (2020) A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper. Journal of Alloys and Compounds. 157750. ISSN 0925-8388

Abstract

Metadata

Authors/Creators:
Copyright, Publisher and Additional Information: © 2020 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
Keywords: Brazing filler metal; High entropy alloy design; Thermoelectrics; Gallium; Metal joining; Python programming
Dates:
  • Accepted: 27 October 2020
  • Published (online): 31 October 2020
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Materials Science and Engineering (Sheffield)
Funding Information:
FunderGrant number
Engineering and Physical Sciences Research CouncilEP/S032169/1
Depositing User: Symplectic Sheffield
Date Deposited: 09 Nov 2020 15:57
Last Modified: 09 Nov 2020 15:57
Status: Published online
Publisher: Elsevier BV
Refereed: Yes
Identification Number: https://doi.org/10.1016/j.jallcom.2020.157750

Share / Export

Statistics