Micro Electronic Systems via Multifunctional Additive Manufacturing

Li, J., Wasley, T., Ta, D. et al. (7 more authors) (2018) Micro Electronic Systems via Multifunctional Additive Manufacturing. Rapid Prototyping Journal. ISSN 1355-2546



  • Li, J.
  • Wasley, T.
  • Ta, D.
  • Shephard, J.
  • Stringer, J.
  • Smith, P.
  • Esenturk , E.
  • Connaughton , C.
  • Harris, R.
  • Kay, R.
Copyright, Publisher and Additional Information: © Emerald Publishing Limited 2018. This is an author produced version of a paper subsequently published in Rapid Prototyping Journal. Uploaded in accordance with the publisher's self-archiving policy.
Keywords: Additive Manufacturing; Process Integration; DLP Stereolithography; Material Dispensing; Multilayer Embedded Electronics; Flip Chip Packaging
  • Accepted: 15 June 2017
  • Published (online): 13 April 2018
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Mechanical Engineering (Sheffield)
Depositing User: Symplectic Sheffield
Date Deposited: 11 Jul 2017 11:37
Last Modified: 10 May 2018 08:32
Published Version: https://doi.org/10.1108/RPJ-02-2017-0033
Status: Published online
Publisher: Emerald
Refereed: Yes
Identification Number: https://doi.org/10.1108/RPJ-02-2017-0033