Micro electronic systems via multifunctional additive manufacturing

Li, J., Wasley, T., Ta, D. et al. (7 more authors) (2018) Micro electronic systems via multifunctional additive manufacturing. Rapid Prototyping Journal, 24 (4). ISSN 1355-2546



Item Type: Article
  • Li, J.
  • Wasley, T.
  • Ta, D.
  • Shephard, J.
  • Stringer, J.
  • Smith, P.
  • Esenturk , E.
  • Connaughton , C.
  • Harris, R.
  • Kay, R.
Copyright, Publisher and Additional Information: © 2018 Emerald Publishing Limited. This is an author produced version of a paper subsequently published in Rapid Prototyping Journal. Uploaded in accordance with the publisher's self-archiving policy.
Keywords: Additive Manufacturing; Process Integration; DLP Stereolithography; Material Dispensing; Multilayer Embedded Electronics; Flip Chip Packaging
  • Accepted: 15 June 2017
  • Published (online): 13 April 2018
  • Published: 13 April 2018
Institution: The University of Sheffield
Academic Units: The University of Sheffield > Faculty of Engineering (Sheffield) > Department of Mechanical Engineering (Sheffield)
Depositing User: Symplectic Sheffield
Date Deposited: 11 Jul 2017 11:37
Last Modified: 12 Apr 2024 14:58
Status: Published
Publisher: Emerald
Refereed: Yes
Identification Number: https://doi.org/10.1108/RPJ-02-2017-0033