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Proceedings Paper

Rathnayake-Arachchige, D, Hutt, DA, Conway, PP et al. (4 more authors) (2013) Patterning of electroless copper deposition on low temperature co-fired ceramic. In: Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. Electronics Packaging Technology Conference (EPTC 2013),, 11-13 December 2013, Singapore. IEEE , 630 - 634. ISBN 978-1-4799-2832-3

Lee, RM, D'Auria, M, Sunday, A et al. (8 more authors) 3D Microwave and Millimetre-wave System-on-Substrate using RF MEMS Components. In: UNSPECIFIED R2i2 Electronics Conference: Connecting Research to Industry, 3 July 2013, Loughborough, UK. . (Unpublished)

This list was generated on Sun Oct 20 02:13:43 2019 BST.